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Insights / Projects / CHIPS National Advanced Packaging Manufacturing Program

CHIPS National Advanced Packaging Manufacturing Program

operational300 million USD 1 mention

A component of CHIPS for America allocating $300 million to industry leaders to develop next-generation substrates and materials for semiconductor packaging.

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Organizations

Arizona State University
Higher education and research
institution United States 13 mentions
Absolics Inc.
Semiconductor materials and packaging
company United States 1 mention
Applied Materials Inc.
Semiconductor equipment manufacturing
company United States 1 mention
Organizations
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Often mentioned with · Organizations

Analog Devices
Semiconductor and analog technology
company United States 1 mention
Corning
Materials science and specialty glass
company United States 1 mention
GlobalData
Market research and consulting
company 1 mention
Organizations
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Often mentioned with · Technologies

Wafer annealing
A semiconductor manufacturing process that uses hydrogen to achieve ultra-pure environments required for chip production.
1 mention
Etching
A semiconductor manufacturing process that uses hydrogen and other specialized gases to remove material from wafers with precision.
1 mention
Advanced packaging
A crucial step in semiconductor production that shields fragile chips, enhances connectivity, and boosts performance.
1 mention
Technologies
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Often mentioned with · Locations

Arizona
Arizona
US 1 mention
United States
United States
US 1 mention

Often mentioned with · Facilities

Natcast's Advanced Packaging Facility
1 mention

In the news (1)

The Surprising Role of Hydrogen in the US Semiconductor Boom

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