Natcast's Advanced Packaging Facility

Semiconductor packaging and manufacturing

Semiconductor materials and packaging

Government administration

Higher education and research

A semiconductor manufacturing process that uses hydrogen and other specialized gases to remove material from wafers with precision.

A semiconductor manufacturing process that uses hydrogen to achieve ultra-pure environments required for chip production.

A semiconductor manufacturing process that uses hydrogen to deposit thin films of material onto wafers.

Arizona

United States

A component of CHIPS for America allocating $300 million to industry leaders to develop next-generation substrates and materials for semiconductor packaging.

A U.S. government initiative providing $1.4 billion in funding to expand domestic semiconductor manufacturing and advanced packaging capabilities.

A collaborative research and scaling facility for semiconductor packaging innovations located in Tempe, Arizona, receiving $1.1 billion in funding.