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Insights / Organizations / Absolics Inc.

Absolics Inc.

companyUnited States 1 mention

Semiconductor materials and packaging

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Projects

CHIPS for America
A U.S. government initiative providing $1.4 billion in funding to expand domestic semiconductor manufacturing and advanced packaging capabilities.
operational 1 mention
CHIPS National Advanced Packaging Manufacturing Program
A component of CHIPS for America allocating $300 million to industry leaders to develop next-generation substrates and materials for semiconductor packaging.
operational 1 mention
Projects
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Often mentioned with · Technologies

Wafer annealing
A semiconductor manufacturing process that uses hydrogen to achieve ultra-pure environments required for chip production.
1 mention
Deposition
A semiconductor manufacturing process that uses hydrogen to deposit thin films of material onto wafers.
1 mention
Advanced packaging
A crucial step in semiconductor production that shields fragile chips, enhances connectivity, and boosts performance.
1 mention
Technologies
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Often mentioned with · Locations

United States
United States
US 1 mention
Arizona
Arizona
US 1 mention

Often mentioned with · Projects

CHIPS National Advanced Packaging Manufacturing Program
A component of CHIPS for America allocating $300 million to industry leaders to develop next-generation substrates and materials for semiconductor packaging.
operational 1 mention
Natcast's Advanced Packaging Facility
A collaborative research and scaling facility for semiconductor packaging innovations located in Tempe, Arizona, receiving $1.1 billion in funding.
under construction 1 mention
CHIPS for America
A U.S. government initiative providing $1.4 billion in funding to expand domestic semiconductor manufacturing and advanced packaging capabilities.
operational 1 mention

Often mentioned with · Facilities

Natcast's Advanced Packaging Facility
1 mention

In the news (1)

The Surprising Role of Hydrogen in the US Semiconductor Boom
Recipient of funding under the CHIPS National Advanced Packaging Manufacturing Program; developing advanced packaging materials to improve energy efficiency in end-use devices.

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